Semiconductor Packaging - ASSEMBLY PROCESS FLOW WATCH LEARN 'N PLAY 26:31 2 years ago 102 386 Скачать Далее
[Eng Sub] Die Attach Process: Paste type adhesive, Film type adhesive Semicon Talk 5:40 3 years ago 29 584 Скачать Далее
S-King Product: Flip Chip Die Bonder (High Precision Solution) LM C 1:39 10 months ago 12 905 Скачать Далее
[Eng Sub] Flipchip die attach process: Bump, MR(Mass Reflow), TCNCP, LAB(Laser Assist Bond), NCP Semicon Talk 5:27 3 years ago 36 244 Скачать Далее
ASM Die bond head speed #asm #asmr #bonding #head #shorts #semiconductor #silicone sili Factory, Machines & Technology 0:17 1 year ago 670 Скачать Далее
Die bond, Die bonging, Die Bonder / Flip Chip Bonder- High Precision Attach System(2020) Shuangshikeji 1:14 3 years ago 10 718 Скачать Далее
Precision die attach process up to +/-10 microns at 3 sigma. Filtronic 1:16 7 months ago 229 Скачать Далее